Brief: Discover the UV Laser PCB Depaneling Machine, offering ±2μm cutting precision for high-speed, non-contact PCB depaneling. Ideal for PCB/FPC/PCBA applications, this machine ensures no dust, no stress, and smooth cutting edges with advanced laser technology.
Related Product Features:
Non-contact ±2μm cutting precision ensures high accuracy without damaging the PCB.
No dust production, maintaining PCB conductivity and cleanliness.
Supports gerber file import for easy and precise operation.
Alien and line cutting options available for versatile applications.
Vacuum adsorption and customized fixture for secure PCB positioning.
High-quality UV laser with no burrs or thermal effects post-cutting.
Mature process system for accurate graphic segmentation and parameter calculation.
Wide application across PCB, FPC, PI, CPI, MPI, PCBA, COF, COP, COB, FR4, and LCP materials.
Faqs:
What is the cutting precision of the Laser PCB Machine?
The Laser PCB Machine offers a cutting precision of ±2μm, ensuring high accuracy for delicate PCB depaneling.
Does the machine produce dust during cutting?
No, the machine is designed for non-contact cutting, producing no dust, which is beneficial for PCB conductivity.
What types of materials can the Laser PCB Machine process?
The machine is versatile and can process various materials including PCB, FPC, PI, CPI, MPI, PCBA, COF, COP, COB, FR4, and LCP.