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Laser PCB Depaneling Machine
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300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

Brand Name: Winsmart
Model Number: SMTL300
MOQ: 1 set
Price: USD1-150K/set
Packaging Details: Plywood case
Payment Terms: L/C,T/T,Western Union
Detail Information
Place of Origin:
China
Certification:
CE
PCB Material:
FR4 FPC
Laser Source:
25W UV
Working Table:
300x300mm, Dual Tables
Fixture:
Customized
Wavelength:
355nm
Name:
UV Laser PCB Depaneling Machine
Supply Ability:
100 sets per month
Product Description

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

 

 

UV Laser PCB Depaneling Machine Overview:

A UV Laser PCB Depaneling Machine is a high-precision system used to separate (depanel) individual printed circuit board units from a larger panel without mechanical stress or contamination. The 300mm × 300mm working area makes this machine suitable for medium-sized PCBs used in mobile devices, medical devices, automotive electronics, and more.
Unlike traditional depaneling methods (e.g., routing, punching, or V-cutting), this machine uses a UV laser to cleanly and accurately cut through PCB substrates (FR4, polyimide, etc.) with no mechanical contact, ensuring no stress, no dust, and no delamination.

 

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine 0

 

UV Laser PCB Depaneling Machine Features:

300×300mm Working Area: Supports medium-sized PCB panels with high flexibility.

UV Laser Cutting: Uses a 355 nm UV laser for high-precision, low-thermal-impact cutting.
No Mechanical Stress: No contact means no micro-cracks or component damage during depaneling.
Dust-Free Operation: No routing or sawing = zero dust and no need for post-cleaning.
High Precision & Accuracy: Cutting accuracy typically ±10 μm or better.
Vision System: CCD camera for fiducial recognition and dynamic alignment.
Programmable Cut Paths: Supports DXF/Gerber file import for complex board outlines.
Low Heat-Affected Zone (HAZ): UV laser minimizes thermal stress and carbonization.
Safety Enclosure: Fully enclosed design with laser shielding and interlock protection.
Auto Mark Alignment: Ensures perfect alignment for repeated, precision cuts.

 

UV Laser PCB Depaneling Machine Specifications:

Model SMTL300, dual tables
Power 380V AC, 50Hz, 20A
Compressed Air Compressed air
Machine Dimension 1450(L)x1350(W)x1665(H)mm
Installation Space 3000x3000x2500mm
Machine Weight 800kgs
Ambient Temperature 22 ~ 25 ℃
temperature variation within ± 1 ℃ / 24hr
ambient humidity within 40% ~ 70% (no obvious condensation is allowed)
Dust free grade 100000 or better
power consumption 6KW
Cutting width ≤ 50mm × 50mm
Cutting materials full cut / half cut of PCB / FPC, LCP / glue and other related materials
Cutting thickness ≤ 3mm
Cutting speed ≤ 3000mm / S
Overall machining accuracy ≤ 30um
Processing pattern straight line, slash, curve, abnormity, etc
Laser 355nm light wave nanosecond laser
Repetition frequency 50-150khz
Laser Power UV 15W@30KHz
Pulse width < 20ns
Energy stability < 3% RMS over 8hours
Beam quality m ² < 1.3
Mode 2500mm/S
Warranty 1 year
Service Oversea training is available

 

 

UV Laser PCB Depaneling Machine Advantages:

UV Laser PCB Depaneling Machine is a high-precision, non-contact depaneling solution designed for cutting, drilling, and marking printed circuit boards (PCBs). It is widely used in electronics, medical devices, automotive, aerospace, and telecommunications industries where high precision and minimal stress are required.

It is used in PCB depaneling due to its short wavelength (355nm) and high absorption efficiency in PCB materials like FR4, polyimide, ceramics, and aluminum-backed substrates. This ensures clean, precise cuts with minimal thermal impact.

 

UV Laser PCB Depaneling Machine Applications:

Smartphone and tablet PCBs
Wearable device electronics (smartwatches, fitness bands)
Medical and implantable devices
Automotive ADAS and infotainment boards
High-density rigid-flex PCBs
LED panel and lighting module depaneling

 

Good price  online

Products Details

Home > Products >
Laser PCB Depaneling Machine
>
300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

Brand Name: Winsmart
Model Number: SMTL300
MOQ: 1 set
Price: USD1-150K/set
Packaging Details: Plywood case
Payment Terms: L/C,T/T,Western Union
Detail Information
Place of Origin:
China
Brand Name:
Winsmart
Certification:
CE
Model Number:
SMTL300
PCB Material:
FR4 FPC
Laser Source:
25W UV
Working Table:
300x300mm, Dual Tables
Fixture:
Customized
Wavelength:
355nm
Name:
UV Laser PCB Depaneling Machine
Minimum Order Quantity:
1 set
Price:
USD1-150K/set
Packaging Details:
Plywood case
Delivery Time:
5-30 days
Payment Terms:
L/C,T/T,Western Union
Supply Ability:
100 sets per month
Product Description

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

 

 

UV Laser PCB Depaneling Machine Overview:

A UV Laser PCB Depaneling Machine is a high-precision system used to separate (depanel) individual printed circuit board units from a larger panel without mechanical stress or contamination. The 300mm × 300mm working area makes this machine suitable for medium-sized PCBs used in mobile devices, medical devices, automotive electronics, and more.
Unlike traditional depaneling methods (e.g., routing, punching, or V-cutting), this machine uses a UV laser to cleanly and accurately cut through PCB substrates (FR4, polyimide, etc.) with no mechanical contact, ensuring no stress, no dust, and no delamination.

 

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine 0

 

UV Laser PCB Depaneling Machine Features:

300×300mm Working Area: Supports medium-sized PCB panels with high flexibility.

UV Laser Cutting: Uses a 355 nm UV laser for high-precision, low-thermal-impact cutting.
No Mechanical Stress: No contact means no micro-cracks or component damage during depaneling.
Dust-Free Operation: No routing or sawing = zero dust and no need for post-cleaning.
High Precision & Accuracy: Cutting accuracy typically ±10 μm or better.
Vision System: CCD camera for fiducial recognition and dynamic alignment.
Programmable Cut Paths: Supports DXF/Gerber file import for complex board outlines.
Low Heat-Affected Zone (HAZ): UV laser minimizes thermal stress and carbonization.
Safety Enclosure: Fully enclosed design with laser shielding and interlock protection.
Auto Mark Alignment: Ensures perfect alignment for repeated, precision cuts.

 

UV Laser PCB Depaneling Machine Specifications:

Model SMTL300, dual tables
Power 380V AC, 50Hz, 20A
Compressed Air Compressed air
Machine Dimension 1450(L)x1350(W)x1665(H)mm
Installation Space 3000x3000x2500mm
Machine Weight 800kgs
Ambient Temperature 22 ~ 25 ℃
temperature variation within ± 1 ℃ / 24hr
ambient humidity within 40% ~ 70% (no obvious condensation is allowed)
Dust free grade 100000 or better
power consumption 6KW
Cutting width ≤ 50mm × 50mm
Cutting materials full cut / half cut of PCB / FPC, LCP / glue and other related materials
Cutting thickness ≤ 3mm
Cutting speed ≤ 3000mm / S
Overall machining accuracy ≤ 30um
Processing pattern straight line, slash, curve, abnormity, etc
Laser 355nm light wave nanosecond laser
Repetition frequency 50-150khz
Laser Power UV 15W@30KHz
Pulse width < 20ns
Energy stability < 3% RMS over 8hours
Beam quality m ² < 1.3
Mode 2500mm/S
Warranty 1 year
Service Oversea training is available

 

 

UV Laser PCB Depaneling Machine Advantages:

UV Laser PCB Depaneling Machine is a high-precision, non-contact depaneling solution designed for cutting, drilling, and marking printed circuit boards (PCBs). It is widely used in electronics, medical devices, automotive, aerospace, and telecommunications industries where high precision and minimal stress are required.

It is used in PCB depaneling due to its short wavelength (355nm) and high absorption efficiency in PCB materials like FR4, polyimide, ceramics, and aluminum-backed substrates. This ensures clean, precise cuts with minimal thermal impact.

 

UV Laser PCB Depaneling Machine Applications:

Smartphone and tablet PCBs
Wearable device electronics (smartwatches, fitness bands)
Medical and implantable devices
Automotive ADAS and infotainment boards
High-density rigid-flex PCBs
LED panel and lighting module depaneling