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Product Details:
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| Driven: | Pneumatic | Testing Report: | Provided |
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| Working Table: | 2 | Condition: | New |
| Program Mode: | PC | Repeatable Precision: | ±0.05mm |
| Axis: | Multi | Name: | Silicone Sealant Dispensing Machine |
| Highlight: | Silicone Sealant Dispensing Machine,Automatic Sealant Dispensing Machine,CCD Robot Glue Dispenser |
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Automatic Silicone Sealant Dispensing Machine Robot Glue Dispenser Equipment
Silicone Sealant Dispensing Machine Application Scope:
Thermal conductive adhesive, SMT bottom filling, component packaging, solder paste, red adhesive, UV adhesive, black adhesive, semiconductor packaging, wafer fixation, etc
Silicone Sealant Dispensing Machine Features:
1. Adopting computer control, Windows operating system, fault sound and light alarm, and menu display
2. CCD visual positioning system
3. Adopting servo motor+screw drive
4. Capable of carrying: pneumatic injection valve, piezoelectric valve, screw valve, AB rubber valve, etc
5. The automatic constant temperature system of the valve body ensures consistent flowability of the coating
6. Optional laser height detection system, which can automatically calibrate the Z-axis height after workpiece deformation
7. Optional workpiece heating system to enhance the fluidity of the coating during bottom filling
8. Optional precision weighing system, intelligent control and detection of dispensing amount, ensuring consistency of dispensing
Silicone Sealant Dispensing Machine Specification:
| Model | SMTDR6 |
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Working area X/Y/Z(mm) |
200*400, Dual Tables |
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Max load Y-axis/Z-axis |
10kg/5kg |
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Moving speed X&Y/Z(mm/sec) |
0.1-800/500 |
| Relolution | 0.01mm/Axis |
| Repeatability | ±0.01mm/Axis |
| Program capacity | No Limit |
| Data storage type | PC Windows 10 |
| Coating Capacity | 30CC |
| Display | LCD |
| Number of axis | 4 |
| Programming method | Visual programming |
| Valve nozzle cleaning device | Optional |
| Power | AC110V/220V |
| Working tem. | 5-50℃ |
| Power Rate | 2.5KW |
| Air pressure | ≥ 0.65Mpa |
| valve quantity | 1(standard) |
| Working Humidity | 20-90% no condensation |
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Dimension (W*D*H)mm |
950*850*850 |
| Weight(Kg) | 150 |
1. Camera module
2. CSP chip underfill
3. Lens Fixing
4. VCM motor dispensing
5. Fingerprint recognition
6. IC encapsulation
7. Chip underfill
8. Metal frame adhesive coating
9. Smartphone and accessories assembly
10. Mobile phone frame hot melt adhesive
11. Speaker assembly
Contact Person: Ms. Amy
Tel: +86-752-6891906
