PC Control 600x600mm Laser PCB Depaneling Machine Suitable For FPC

PC Control 600x600mm Laser PCB Depaneling Machine Suitable For FPC

Win 10 PC Control 600x600mm UV Laser Cutting Machine Suitable for FPC and PCB

UV Laser Cutting Machine Introduction:

Compared with the quality problem of traditional manual folding, the emergence of PCB UV laser cutting machine makes up for this disadvantage. PCB depaneling machine has obvious advantages. PCB laser depaneling machine has high work efficiency in production. PCB depaneling machine is very safe when working. Any enterprise should pay attention to the production safety of products in addition to the quality of products, This process has been mandatory by European and American customers as early as 2004.

UV Laser Cutting Machine Principle:

The principle of this UV laser cutting machine is to irradiate the surface of PCB circuit board with high-energy beam, and realize the vaporization cutting of PCB materials by controlling the parameters such as beam energy density, frequency, speed and processing times.

UV Laser Cutting Machine Specification:

UV Laser Cutting Machine Advantages:

1. No dust
The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product.

2. High cutting precision
The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high.

3. No stress
Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board.

4. For special-shaped cutting, it is easy to automate
The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting.

5. High compatibility
The UV laser cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain.

6. Good cutting edge effect
The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing.