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Product Details:
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| Type: | Pulse Heat Bonding | Min Pin Pitch: | 0.2mm |
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| Application: | FPC To PCB, FFC To PCB, Wires To PCB, ACF Film Soldering | Temperature Precision: | 2℃ |
| CE Certificate: | Provide | Name: | ACF Bonding Machine |
| High Light: | Single Table ACF Bonding Machine,Single Head ACF Bonding Machine,Cylinder Control Hot Bar Soldering Machine |
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Single Table Single Head Economic ACF Bonding Machine
ACF Bonding Machine Features:
Unique pulse heat technology provides fastest soldering head heating.
Programmable soldering temperature, heat-up rate and time duration for a wide range of products.
Thermocouple is fixed in close proximity to the working surface & the thermode, thus providing accurate temperature feedback control.
Closed Loop PID temperature control with clearly visible LED display.
Soldering time can be programmable and is triggered by temperature.
Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined.
Programmable pressure switch with LCD display for precise force control.
CCD camera system with magnification lens can be retrofitted for fine-pitch positioning.
ACF Bonding Machine Specification:
| Machine size | 550×640×620mm |
| Working area | Max 150*110mm |
| Machine weight | 62Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 1 |
| Thermode head size | Max 80*5mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Feeding mode | Manual |
| Starting mode | Press start button |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
ACF Bonding Machine Application:
Contact Person: Ms. Amy
Tel: +86-752-6891906
