|Cutting Precision:||±5μm||Service:||7/24hours Online Support|
|Working Area:||Could Be Customized||Scan Range:||40x40mm|
|Warranty:||12 Months||Name:||Automatic Laser Depaneling System|
Automatic Laser Depaneling Machine,
355nm Laser Depaneling Machine,
Non Contact Laser Pcb Machine
Non-contact Depaneling Method Automatic Laser Depaneling System
Automatic Laser Depaneling Introduction:
No mechanical dies or blades are needed for laser depaneling, which is completely software-controlled.
Any shape path, including curves and sharp corners, can be completed with this method, which also provides an unparalleled space advantage.
Tooling expenses and expansive fixtures for die-cutting and other conventional methods is eliminated with Laser depaneling.
Laser depaneling is done with speed, pin-point accuracy, no tooling cost or wear, no part induced stress, and no cutting oils or other waste. A no-touch depaneling method using lasers provides a highly precise singulation without any risk of harming material, regardless of substrate.
The technology also works in the optimum pulse duration range for printed circuit board material processing. This pulse range plays a key role in processing efficiency and leads to lower cost and maximum use of processing time.
An exhaust or filter system removes any expelled material during the laser process.
If the application does produce an extremely small particle residue, compressed air or a smooth tissue can be used.
1. No mechanical stress
2. Lower tooling costs
3. Higher quality of cuts
4. No consumables
5. Design versatility-simple software changes enable application changes
Automatic Laser Depaneling Specification:
|Laser||Q-Switched diode-pumped all solid-state UV laser|
|Laser Source||Optowave UV 15W@30KHz|
|Positioning Precision of Worktable of Linear Motor||±2μm|
|Repetition Precision of Worktable of Linear Motor||±1μm|
|Effective Working Field||300mmx300mm(Customizable)|
|Scanning Speed||2500mm/s (max)|
Automatic Laser Depaneling Cutting Result:
Automatic Laser Depaneling Applications:
Depaneling flex and rigid PCBs
Cover layer cutting
Cutting fired and unfired ceramics
Contact Person: Sales Manager