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Product Details:
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| Usage: | Welding | Weight: | 62kgs |
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| Voltage: | 220V/110V | Temperature Accuracy: | ±2°C |
| After-sale Service: | Engineers Available To Service Machinery Overseas | Name: | PCB Bonding Machine |
| High Light: | 0.2mm Hot Bar Soldering Machine,Hot Bar Soldering Machine 0.8Mpa,SMT Assembly Equipment |
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SMT Assembly Equipment PCB Bonding Machine PCB Soldering Machine
PCB Bonding Machine Applicable Area:
LCD Module, Solar Battery, Camera , Electronic Components, Coil / Inductor, Mobile Devices, PWB, Power Devices.
All where there need to be heated or fusing or joining or forming.
PCB Bonding Machine Features:
1. Unique pulse heat technology provides fastest soldering head heating.
2. Programmable soldering temperature, heat-up rate and time duration for a wide range of products.
3. Thermocouple is fixed in close proximity to the working surface & the thermode, thus providing accurate temperature feedback control.
4. Closed Loop PID temperature control with clearly visible LED display.
5. Soldering time can be programmable and is triggered by temperature.
6. Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined.
7. Programmable pressure switch with LCD display for precise force control.
8. CCD camera system with magnification lens can be retrofitted for fine-pitch positioning.
PCB Bonding Machine Specification:
| Machine size | 610×410×450mm |
| Working area | Max 150*150mm |
| Machine weight | 62Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 2 |
| Thermode head size | Max 40*3mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start button |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
Customers' Applications:
Heat Bonding Paratmeter:
| Temperature range | 50℃ to 500℃ |
| Temperature accuracy | ±1°C |
| Bond timer | 0-12 seconds |
| Bond air pressure | 0.4-0.6MPa |
| Pressure accuracy | ±0.05MPa |
| Max bond force | 1100N |
Our Advantages:
Our machine is completed with fine finishing in accordance with the quality standards of the industry.
Our strict quality management system maintains the excellent performance and quality of our products.
The product is the preferred one in the fields for its huge economic benefits.
Delivery Terms:
1. Ex-work/FOB/CIF/DDU, up to clients
2. Production leadtime: 7-15 days to customized make fixtures/jigs and test it with the punching machine.
Contact Person: Ms. Amy
Tel: +86-752-6891906
