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110V Pulse Heat Bonding Machine , Hot Bar Soldering Equipment FFC To PCB

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China Winsmart Electronic Co.,Ltd certification
China Winsmart Electronic Co.,Ltd certification
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110V Pulse Heat Bonding Machine , Hot Bar Soldering Equipment FFC To PCB

110V Pulse Heat Bonding Machine , Hot Bar Soldering Equipment FFC To PCB
110V Pulse Heat Bonding Machine , Hot Bar Soldering Equipment FFC To PCB 110V Pulse Heat Bonding Machine , Hot Bar Soldering Equipment FFC To PCB

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Product Details:
Place of Origin: China
Brand Name: Winsmart
Certification: CE
Model Number: SMTS11
Payment & Shipping Terms:
Minimum Order Quantity: 1 set
Price: USD1-10000/Set
Packaging Details: Plywood case
Delivery Time: 5-8 days
Payment Terms: L/C, T/T, Western Union
Supply Ability: 200 sets per month

110V Pulse Heat Bonding Machine , Hot Bar Soldering Equipment FFC To PCB

Description
Min Pin Pitch: 0.2mm Type: Soldering Machine
Voltage: 220V/110V Condition: New
Package: Customers' Requirement Name: Pulse Heat Bonding Machine
High Light:

FFC to PCB Hot Bar Soldering

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110V Pulse Heat Bonding Machine

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110V Hot Bar Soldering Equipment

Pulse Heat Bonding Machine FFC to PCB Hot Bar Soldering Equipment

 

 

Pulse Heat Bonding Machine Principle:

The hot bar power supply provide the current to heat the thermode which is high resistivity such as W,Mo,Ti. The temperature climb up to a certain value to melt theTIN and the solder, when the temperature drop down, the workpiece is connected by the TIN. A pressure is working through all the process and the temperature is accurately controlled by the IGBT inverter power supply.

 

Pulse Heat Bonding Machine Features:

1. According to different products, optional temperature for your choice.

2. Unique material thermode head, ensure the average pressure

3. Has vacuum function, easier for adjustment and positioning.

4. NC temperature, clear and high precision

5. With digital pressure gauge, pressure range can be preset.

6. Microcomputer control, high accuracy and stable.

7. Programmable curve Including pre-heating and reflow soldering temperature.

8. Suitable for all kinds of high density TAB, TCP and pressure to FPC, FFC and PCB soldering pressure welding.

9. Precise PID control, phase angle replace pulse drive.

10. Less Libration, less noise, avoiding voltage fluctuate

11. Real-time display temperature curve and temperature data.

12. Touch screen input data, simplify the operation.

 

Pulse Heat Bonding Machine Application:

For a variety of high density TAB, TCP crimping and FPC, FFC and PCB solder crimp.

110V Pulse Heat Bonding Machine , Hot Bar Soldering Equipment FFC To PCB 0

Pulse Heat Bonding Machine Specification:

Machine size 590×640×620mm
Working area Max 200*170mm
Machine weight 89Kg
Working air pressure 0.6-0.8Mpa
Fixture quantity 1
Thermode head size Max 40*3mm
Welding precision pitch 0.2mm
Pressing time 1~99.9s
Temperature settings RT~500℃ tolerance ±5℃
Welding pressure 1~20Kg
Temperature settings Two
Working environment 10-60℃,40%-95%
Power supply AC220V±10% 50HZ,2200W
Alignment mode CCD + LCD Monitor
Feeding mode Manual
Starting mode Press start button
Rotation Platform Cylinder control,tolerance<0.02mm

 

 

Pulse Heat Bonding Machine FAQ:

Q: What is cycle time of soldering?

A: 5-15 seconds.

Q: Is there any special requirements?

A: Must apply solder paste on the pads before soldering.

Q: What is min pin pitch?

A: 0.15mm

Q: What is the material of thermode head?

A: Molybdenum alloy.

Q: How to maintain thermode head?

A: Please clean thermode head everyday and make sure its flatness by grinder.

 

Contact Details
Winsmart Electronic Co.,Ltd

Contact Person: Ms. Amy

Tel: +86-752-6891906

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