|Cutting Precision:||±5μm||Work Temp.:||25℃|
|Laser Brand:||Optowave||Name:||PCB Laser Cutting Machine|
V Score Laser PCB Depaneling Machine,
FPC Laser PCB Depaneling Machine,
Water Cooled Laser Depaneling Machine
PCB Laser Cutting Machine Laser Depaneling of Assembled PCBs/FPCs
Q: What kind of PCBs are workable to use this machine?
A: FPC and FR4 panels, covering v score and tab boards.
Q: What is laser head of the machine?
A: We use USA Optowave laser.
Q: What kind of laser source you provide?
A: Green, CO2, UV and picosecond.
Q: What is cutting speed?
A: It depends on PCB material, thickness and cutting effect requirements.
Q: Does it cause dust during cutting?
A: No dust, but smoke, machine comes with exhaust system and water cooler
PCB Laser Cutting Machine Advantages:
1. No mechanical stress
2. Lower tooling costs
3. Higher quality of cuts
4. No consumables
5. Design versatility—simple software changes enable application changes
6. Works with any surface—Teflon, ceramic, aluminum, brass and copper
PCB Laser Cutting Machine Specification:
|Laser||Q-Switched diode-pumped all solid-state UV laser|
|Laser Source||Optowave UV 15W@30KHz|
|Positioning Precision of Worktable of Linear Motor||±2μm|
|Repetition Precision of Worktable of Linear Motor||±1μm|
|Effective Working Field||300mmx300mm(Customizable)|
|Scanning Speed||2500mm/s (max)|
PCB Laser Cutting Machine Cutting Materials
1. Flexible circuit boards, rigid circuit boards, rigid-flex circuit board sub-board processing.
2. Rigid, flexible circuit board sub-board processing component is installed.
3. Thin copper foil, a pressure-sensitive adhesive sheet (PSA), an acrylic film, a polyimide coating film.
4. Thickness of 0.6mm or less precision ceramic cutting, dicing; variety of cutting the base material (silicon, ceramics, glass, etc.)
5. Etching precision molding various functional films, an organic film and other precision cutting.
6. Polymer: polyimide, polycarbonate, polymethyl methacrylate, FR-4, PP, etc.
7. Functional film: gold, silver, copper, titanium, aluminum, chromium, ITO, silicon, poly-crystalline silicon, amorphous silicon and a metal oxide.
8. Brittle material: monocrystalline silicon, polycrystalline silicon, ceramic and sapphire.
PCB Laser Cutting Machine Cutting Result:
Contact Person: Sales Manager