Laser PCB Depaneling FPC Laser Separator, has the following advantages:
1. Fast and high precision: The combination of a high-precision, low-drift galvanometer and a fast iron-core linear motor system platform enables fast cutting while maintaining micron-level precision.
2. High-performance laser: The solid-state UV laser of the international first-line brand is adopted, which has the advantages of good beam quality, small focus spot, uniform power distribution, small thermal efficiency, small slit width, and high cutting quality, which guarantees perfect cutting quality.
3. The cutting edges are neat and round, smooth, without burrs, and without glue overflow. The products can be arranged in a matrix for automatic positioning and cutting, which is especially suitable for the cutting of fine, difficult, and complex patterns.
4. Can be integrated with the production line: gantry structure and flying light path design, easy to connect to the production line, can be equipped with special loading and unloading and IN-LINE systems according to production requirements, to achieve full automation of production and greatly improve production efficiency.
5. Efficient and fast FPC/PCB profile cutting, drilling and covering film opening, fingerprint recognition chip cutting, TF memory card cutting, mobile phone camera module cutting and other applications.
Contact Person: Ms. Amy